Qualitek 862 Lead Free No Clean Solder Paste SAC 305 (Type 3 & 4)

The 862 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys Provides the fluxing activity levels that promote thermal stability and
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Stock Type/Size SKU 1-4 5+ Qty Total
0 SAC 305 Type 3 - 500gm JAR LF-862-J £91.30
Ex. VAT
£86.74
Ex. VAT
£0.00
Ex. VAT
0 SAC 305 Type 3 - 500gm CART LF-862-C £92.29
Ex. VAT
£87.68
Ex. VAT
£0.00
Ex. VAT
0 SAC 305 Type 4 - 500gm JAR LF-862-J-T4 £93.78
Ex. VAT
£89.09
Ex. VAT
£0.00
Ex. VAT
0 SAC 305 Type 4 - 500gm CART LF-862-C-T4 £94.77
Ex. VAT
£90.03
Ex. VAT
£0.00
Ex. VAT

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Qualitek 862 Lead Free No Clean Solder Paste SAC 305 (Type 3 & 4)

£91.30

The 862 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys

Provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since the use of nitrogen is not required, 862 Lead Free Solder paste will provide excellent cost savings

  • Alloy: SAC305 (Sn96.5/Ag3.0/Cu0.5)
  • Powder Size: Type 3 (25-45um) Type 4 (20-38um)
  • Low voiding
  • Excellent wettability
  • Long tack time
  • Excellent hot slump resistance
  • Medium soft non-cracking residues
  • Extended stencil life

862 is a no clean formulation therefore the residues do not need to be removed. If removal is desired, the use of Everkleen 1005 Buffered Saponifier will aid any residue removal.