Name: Qualitek 862 Lead Free No Clean Solder Paste SAC 305 (Type 3 & 4)
Brand: Qualitek
SKU: LF-862-J
Price: 91.3 GBP
Availability: InStock

Qualitek 862 Lead Free No Clean Solder Paste SAC 305 (Type 3 & 4)

Qualitek 862 Lead-Free No Clean Solder Paste (SAC305, Type 3 & 4) is designed specifically for high-temperature lead-free soldering applications. With a unique flux system, this paste pro
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DOWNLOAD INFORMATION DATASHEETS

1. Safety Data Sheet

2. Technical Data Sheet

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Type/Size	SKU	1-4	5+	Total
SAC 305 Type 3 - 500gm JAR	LF-862-J	£91.30 Ex. VAT	£86.74 Ex. VAT	£0.00 Ex. VAT
SAC 305 Type 3 - 500gm CART	LF-862-C	£92.29 Ex. VAT	£87.68 Ex. VAT	£0.00 Ex. VAT
SAC 305 Type 4 - 500gm JAR	LF-862-J-T4	£93.78 Ex. VAT	£89.09 Ex. VAT	£0.00 Ex. VAT
SAC 305 Type 4 - 500gm CART	LF-862-C-T4	£94.77 Ex. VAT	£90.03 Ex. VAT	£0.00 Ex. VAT

Pickup available at Grove Sales Ltd

If stock level is 0 or not shown, you can still ORDER ONLINE and we will advise you by email when your back-ordered item/s will be delivered.

Qualitek 862 Lead-Free No Clean Solder Paste (SAC305, Type 3 & 4) is designed specifically for high-temperature lead-free soldering applications.

With a unique flux system, this paste promotes thermal stability and prevents thermal degradation during reflow in air atmospheres, eliminating the need for nitrogen and resulting in significant cost savings.

Formulated with the SAC305 alloy (Sn96.5/Ag3.0/Cu0.5), it offers excellent wettability, low voiding, and excellent hot slump resistance.

The paste features medium-soft, non-cracking residues, which do not require removal, although Everkleen 1005 Buffered Saponifier can be used if necessary.

Available in Type 3 (25-45um) and Type 4 (20-38um) powder sizes, the paste offers long tack time and extended stencil life for reliable, high-quality soldering.

Alloy composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Powder sizes: Type 3 (25-45µm) and Type 4 (20-38µm)
No Clean formulation: Residues do not need removal, but Everkleen 1005 Buffered Saponifier can be used if desired
Low voiding for clean solder joints
Excellent wettability for smooth and efficient soldering
Long tack time for flexibility during assembly
Excellent hot slump resistance for reliable soldering performance
Medium-soft, non-cracking residues for easy handling
Extended stencil life for prolonged use
Cost-effective: No nitrogen required for reflow, reducing operational costs

Product Inquiry

For more information about this product, please get in touch. Simply fill out the form, specify the system you’re interested in, and a member of the team will get back to you. Alternatively, you can use our LIVE CHAT and speak directly to a member of our Sales Team.