TB 2217L 13g
TB 2217L 40g

SMT Epoxy Resin Adhesive 2217L

TB2217L is a single component epoxy resin developed for bonding electronic chips, curing at temperatures of 80ºC and above. Its properties are designed for ease of handling to enable use in automa
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1. Technical Data Sheet

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Stock Paste Flux SKU 1-4 5+ Qty Total
8 13g/10cc Syringe 390-TB2217H £14.75
Ex. VAT 		£14.01
Ex. VAT 		£0.00
Ex. VAT
0 40g/30cc Syringe 390-TB2217H-30 £21.52
Ex. VAT 		£20.44
Ex. VAT 		£0.00
Ex. VAT
Pickup available at Grove Sales Ltd

If stock level is 0 or not shown, you can still ORDER ONLINE and we will advise you by email when your item/s will be delivered.

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SMT Epoxy Resin Adhesive 2217L

£14.75
SMT Epoxy Resin Adhesive 2217L

13g/10cc Syringe

  • Grove Sales Ltd

    Pickup available, call to arrange a suitable date and time

    Unit 3 Beaver Industrial Estate, 8 Airfield Road
    Christchurch BH23 3TG
    United Kingdom

    +441202588900
TB 2217L 13g
TB 2217L 40g

TB2217L is a single component epoxy resin developed for bonding electronic chips, curing at temperatures of 80ºC and above.

Its properties are designed for ease of handling to enable use in automated assembly by either syringe or screen print application.

Ideal viscosity and thixotropic properties for dispensing and screen printing. Maintains shape after application.

  • No cobwebbing, no dispenser feeding problems, excellent process ability.
  • 2 Sizes available 13g or 40g. 
  • Hardens in less than 60 seconds at 150ºC.
  • Heat curing initiated at just 80ºC.
  • Excellent heat resistance.
  • Meets the requirements of IPC SM817, TM-650 Method 2.4.42.1: R-1206 on bare FR4 board supported 60 seconds above solder bath at 260ºC and dipped for 10 seconds

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