Qualitek 825 Lead Free No Clean Solder Paste SAC 305 (Type 4)

The latest paste from Qualitek, the 825 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys Features: It provides the fluxing activi
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Stock Type/Size SKU 1-4 5+ Qty Total
0 SAC 305 Type 4 - 500gm JAR LF-825-J £93.78
Ex. VAT
£89.09
Ex. VAT
£0.00
Ex. VAT
0 SAC 305 Type 4 - 500gm CART LF-825-C £94.77
Ex. VAT
£90.03
Ex. VAT
£0.00
Ex. VAT

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Qualitek 825 Lead Free No Clean Solder Paste SAC 305 (Type 4)

£93.78

The latest paste from Qualitek, the 825 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys

Features: It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since the use of nitrogen is not required, 825 Lead Free Solder paste will provide excellent cost savings

  • Low Voiding
  • Excellent wettability
  • Long tack time
  • Excellent hot slump resistance
  • Medium soft non-cracking residues
  • Extended stencil life
  • Alloy: LF965-30 - SAC305 (Sn96.5/Ag3.0/Cu0.5)
  • Powder Size: Type 4 (20-38um)

825 is a no clean formulation therefore the residues do not need to be removed. If removal is desired, the use of Everkleen 1005 Buffered Saponifier will aid any residue removal.