Qualitek No Clean NC601 Lead Free Wire SN100e

The Qualitek NC601 No Clean Flux Lead Free Sn100e Solder Wire offers an excellent, cost-effective alternative to SAC alloys and is ideal for those transitioning from lead-based solders.   Made
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1. Safety Data Sheet

2. Technical Data Sheet

3. Information Sheet

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Stock Wire Guage SKU 1-4 5+ Qty Total
0 0.38mm LF-601-0.38-SN £64.25
Ex. VAT 		£61.04
Ex. VAT 		£0.00
Ex. VAT
1 0.5mm LF-601-0.5-SN £58.19
Ex. VAT 		£55.28
Ex. VAT 		£0.00
Ex. VAT
0 0.8mm LF-601-0.81-SN £47.01
Ex. VAT 		£44.66
Ex. VAT 		£0.00
Ex. VAT
9 1.2mm LF-601-1.2-SN £51.62
Ex. VAT 		£49.04
Ex. VAT 		£0.00
Ex. VAT
Pickup available at Grove Sales Ltd

If stock level is 0 or not shown, you can still ORDER ONLINE and we will advise you by email when your back-ordered item/s will be delivered.

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Qualitek No Clean NC601 Lead Free Wire SN100e

£64.25
Qualitek No Clean NC601 Lead Free Wire SN100e

0.38mm

  • Grove Sales Ltd

    Pickup available, if stocked, call to arrange a suitable date and time

    Unit 3 Beaver Industrial Estate, 8 Airfield Road
    Christchurch BH23 3TG
    United Kingdom

    +441202588900

The Qualitek NC601 No Clean Flux Lead Free Sn100e Solder Wire offers an excellent, cost-effective alternative to SAC alloys and is ideal for those transitioning from lead-based solders.

 

Made with a high-purity alloy of 99.5% Tin, 0.5% Copper, and a trace amount of Cobalt, this solder wire exceeds industry standard specifications.

The synthetic flux, combined with a highly effective activator, ensures smooth wetting and spreading properties, similar to RA-type fluxes, while producing minimal splattering. The solder wire’s flux core content is 2.2%, and it features a melting point of 228°C, making it a reliable choice for precise and clean soldering.

The no-clean, colophony-free flux ensures that there is no residue left behind after soldering, with any remaining residue easily removed with hot DI water or by brushing. Ideal for high-precision electronics applications, the NC601 solder wire simplifies assembly with minimal post-soldering maintenance.

  • Lead-Free Alloy: 99.5% Tin, 0.5% Copper, and a trace of Cobalt for superior purity.
  • Melting Point: 228°C for reliable soldering performance.
  • Flux Core Content: 2.2% ensuring optimal flux distribution.
  • No Clean, Colophony-Free Flux: Leaves virtually no residue after soldering.
  • Synthetic Flux: Effective wetting and spreading properties, similar to RA-type fluxes.
  • Minimal Splattering: Ensures a cleaner, smoother soldering process.
  • Residue Removal: No cleaning required, but residues can be removed with hot DI water or brushing.
  • 500g Reel Size: Ideal for high-volume soldering tasks.
  • Classification: ORL0 NC601 for high reliability and performance in electronics assembly.

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